The effect of homogenization on microstructure and hot ductility behaviour of AZ91 magnesium alloy EBRAHIMI, G. R., MALDAR, A. R., EBRAHMI, R., DAVOODI, A., MOSHKSAR, M. Key words: AZ91, homogenization heat treatment, ß precipitates, hot deformation, microstructure vol. 48 (2010), no. 5, pp. 277 - 287 DOI: 10.4149/km_2010_5_277 Article | Full Text (500 kB)A kinetic model for analyzing the growth kinetics of Fe2B layers in AISI 4140 steel ORTIZ-DOMINGUEZ, M., HERNANDEZ-SANCHEZ, E., MARTINEZ-TRINIDAD, J., KEDDAM, M., CAMPOS-SILVA, I. Key words: boriding, kinetic model, diffusion; layers, simulation vol. 48 (2010), no. 5, pp. 285 - 290 DOI: 10.4149/km_2010_5_285 Article | Full Text (177 kB) Unidirectional solidification of aluminium-nickel eutectic alloy KAYA, H., BOYUK, U., CADIRLI, E., MARASLI, N. Key words: Al-Ni alloys, eutectic growth, eutectic spacing, undercooling vol. 48 (2010), no. 5, pp. 291 - 300 DOI: 10.4149/km_2010_5_291 Article | Full Text (503 kB) Innovative solutions for roughness problems related to MCrAlY coatings manufacturing by HVOF I: Base Material/Bond Coat Interface GIOLLI, C., RUSSO, D., LANZI, A., SPAGNOLI, M., RIZZI, G., GIORGETTI, A., SCRIVANI, A. Key words: MCrAlY, HVOF, thermal barrier coating, interface, sand blasting vol. 48 (2010), no. 5, pp. 301 - 306 DOI: 10.4149/km_2010_5_301 Article | Full Text (423 kB) Innovative solutions for roughness problems related to MCrAlY coatings manufacturing by HVOF II: Bond Coat/Top Coat Interface GIOLLI, C., RUSSO, D., LANZI, A., SPAGNOLI, M., RIZZI, G., GIORGETTI, A., SCRIVANI, A. Key words: MCrAlY, HVOF, thermal barrier coating, interface, sand blasting vol. 48 (2010), no. 5, pp. 307 - 312 DOI: 10.4149/km_2010_5_307 Article | Full Text (327 kB) Studies of Cu after plastic deformation RODAK, K., RADWANSKI, K., MOLAK, R., PAKIELA, Z. Key words: severe plastic deformation, copper, fine-grained microstructure, EBSD, TEM vol. 48 (2010), no. 5, pp. 313 - 319 DOI: 10.4149/km_2010_5_313 Article | Full Text (407 kB) lectrical resistivity of liquid lead-free solder Sn-0.7Cu-xBi alloys ZHANG, F., LI, X., ZU, F., LIU, L., HAN, Y., XIE, M. Key words: lead-free solder, electrical resistivity, liquid structural transition, Sn-Cu-Bi alloys vol. 48 (2010), no. 5, pp. 321 - 326 DOI: 10.4149/km_2010_5_321 Article | Full Text (364 kB) Numerical simulation of induction heating of a rod semiproduct for the process of rotary spin extrusion BEHULOVA, M., MASEK, B., MEYER, L. W. Key words: rotary spin extrusion, induction heating, numerical simulation, electro-magnetic fields, temperature fields vol. 48 (2010), no. 5, pp. 327 - 336 DOI: 10.4149/km_2010_5_327 Article | Full Text (567 kB)
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