[Kovove materialy - Metallic materials]
    Fri - November 22, 2024 - 04:21 No. of hits : 1800308 ISSN 1338-4252 (online) ISSN 0023-432X (printed)
© Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovak Republic

VOLUME 60 (2022), Issue 6

Effect of diamond particle type on the thermal properties of diamond/copper composites
QINGZHU GE, MENG YAN, YANG JIANG, YONGHONG WANG, JUNWU LIU
vol. 60 (2022), no. 6, pp. 363 - 372
DOI: 10.31577/km.2022.6.363

Abstract
The molten salt method was used to plate chromium on the surfaces of MBD (Diamond grains for the Metal Bond tool) and RVD (Diamond grains for Resinoid and Vitrified bond) diamond particles, respectively, to metalize their surfaces. The Cr-coated diamond/copper composites were obtained by vacuum hot pressing method, and the thermal conductivity and coefficient of thermal expansion of the two composites were compared. The results indicate that the thermal conductivity of both composites prepared by Cr-coated diamond particles and copper matrix was greatly improved. The thermal conductivity showed a trend of increasing and then decreasing with the increase of chromium content. The thermal conductivity of RVD diamond/copper composites was up to 483 W m-1 K-1, and MBD diamond/copper composites was up to 450 W m-1 K-1, and the thermal conductivity of RVD diamond/copper composites was generally higher than that of MBD diamond/copper composites, the CTE of the composites prepared by Cr-coated diamond particles and copper matrix decreased significantly.

Key words
metal matrix composite, RVD diamond, MBD diamond, thermal conductivity, thermal expansion coefficient

[open article.pdf] Full text (2069 KB)

[IMMS SAS]      UMMS SAV - Bratislava (SK) Personal data Protection   ver. 1.8.0      [go to HOME PAGE]
Full title of this journal is bilingual: Kovové materiály - Metallic Materials.
The official abbreviation in accordance with JCR ISI is Kovove Mater.


Article abstracts updated: 2024-11-05 11:34      
Articles in press revised: 2024-11-14 07:57     
Full text pdf uploaded: 2024-11-06 09:09    
Information updated: 2023-04-19 16:14   
Code last revised: 2024-03-06 11:13  

© OldSoft, 2004, …, 2024