Deformation mechanisms in copper-intermetallic layered composite at elevated temperatures KONIECZNY, M. vol. 45 (2007), no. 6, pp. 313 - 317
Abstract This article is mainly devoted to examination of the structure evolution in the course of straining of the copper-intermetallic phases layered composite at temperatures of 20-700 °C. Investigations of the slip lines distribution obtained in a tensile test specimen revealed that shear banding was the essential feature of the composite deformation up to 300 °C. Microstructural observations of specimens tested in the range 400-600 °C revealed that intermetallic layers of the composite still cracked brittly but copper recrystallized dynamically, especially between opposite cracks. No cracks in intermetallics were observed after deformation at 700 °C. Mechanical tests showed that up to 600 °C the yield strength for layered copper-intermetallics composites changes inconsiderably (only about 10 %). Key words copper, layered composite, intermetallic phases Full text (287 KB)
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