Abstract
Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn₉₆Ag₄, Sn₉₉Cu₁, Sn₉₇Cu₃, Sn_96.5Ag₃Cu_0.5, Sn_95.5Ag_3.8Cu_0.7 and Sn₆₃Pb₃₇ were studied in the temperature range from room temperature up to 400 °C. The transformation temperatures for melting as well as for solidification were influenced by the composition and thermal history of the alloys. The thermal history was altered by changing the maximum thermal cycle temperature and the heating/cooling rate. It is shown that the rate of solidification is far larger than that of the melting. The solidification rate is not influenced by neither the composition nor the thermal history of the material. Analysis of these results is presented.

Key words
Sn alloys, phase transformations, undercooling solidification, DSC

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