Abstract
In the first part of the present paper, the slip pattern of copper single crystals oriented for easy glide, subjected to creep at temperatures 873, 923, and 973 K and applied stresses ranging from 3 to 12 MPa is investigated. Creep testing times ranged from 1 to 6000 ks, the creep strains did not exceed 0.09. The contribution to the creep strain due to slip in slip bands, ε_SB, increases with applied stress σ but does not depend on temperature significantly. With increasing applied stress the mean height of surface steps associated with slip bands decreases but the density of these steps increases. The inhomogeneity of creep deformation in single crystals is due to the appearance of zones with restricted development of the slip bands. These zones are oriented perpendicularly to the slip vector of the dominant slip system. Observed appearance of "small" slip bands of the secondary slip system is discussed. These slip bands are developed at the highest testing temperature and low applied stresses.

Key words
copper, creep, creep deformation, single crystals, slip bands

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