Abstract
The temperature dependence of electrical resistivity of liquid Sn-Sb alloys has been investigated in several heating and cooling cycles, using D.C. four-probe method. Obvious reversible changes are observed on resistivity-temperature curves of the investigated Sn-Sb alloys, and there are clear turning points both on heating and cooling process in several experimental cycles. However, the temperature of turning points and the resistivity change trend in the first cycle heating are different from those of the subsequent cooling and heating cycles, it is suggested that there are temperature-induced liquid-liquid transitions in Sn-Sb alloys, moreover the transitions are partly reversible. The effect of the liquid-liquid structure transition (L-LST) on the solidification behaviour and morphology of Sn-Sb80wt% is further studied. The results show that solidification behaviour and solidified microstructure would be distinct when the melt experienced the L-LST.

Key words
Sn-Sb alloys, electrical resistivity, reversible liquid-liquid transition, solidification behaviour

Full text (341 KB)