Abstract
Ni-Cu alloy thin films were electroplated onto graphite substrates in three electrode setup at varying applied overpotentials of –1.4, –1.5, and –1.6 V with an approximate Cu:Ni ratio of 1:20, 1:15, and 1:11 where the concentration of Ni was 0.175 M, and Cu were 0.009 M, 0.012 M, 0.015 M, respectively. The cyclic voltammetry experiments reveal that during the co-reduction of Cu and Ni there was no distinct peak. However, the dissolution had taken place with absolute anodic peaks for corresponding elements. Morphological results showed there was a transition from wavy layered structure to the nodular structure with an increase in deposition potential and Cu concentration in the bath. The compositional analysis revealed that the film was getting richer in Ni with an increase in deposition potential and a decrease in Cu ion concentration in the electrolyte bath. Magnetic Force Microscopy (MFM) technique indicated that there was a definite and distinct impact of deposition potential and composition on the distribution of magnetic phase in the alloy film.

Key words
Ni-Cu alloy, thin film, Magnetic Force Microscopy (MFM), electrodeposition, cyclic voltammetry

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