[Kovove materialy - Metallic materials]
    Wed - March 21, 2018 - 04:21 No. of hits : 912386 ISSN 1338-4252 (online) ISSN 0023-432X (printed)
© Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovak Republic

VOLUME 55 (2017), Issue 1

Strength and electrical conductivity of roll-bonded Cu/Al-Mg-Si/Cu clad composite
KIM, W.-N., HONG, S. I.
vol. 55 (2017), no. 1, pp. 7 - 12

Tri-layered Cu/Al-Mg-Si/Cu clad composite was cold roll-bonded, and its mechanical/electrical properties were studied. In the roll-bonded and aged Cu/Al-Mg-Si/Cu clad composite, neither interfacial reaction layer nor interface defects were observed. The strength as high as 415 MPa with the conductivity of 82 % IACS was attained in 3-ply light-weight Cu/Al-Mg-Si/Cu clad composite. The ductility and conductivity of clad composite are increased appreciably with heat treatment at 175 °C. After mechanical testing, the interface crack propagation and fracture in the well-bonded interface between metallic Cu and Al occurred in softer Al matrix. The increase of detached Al lumps onto the separated Cu side in clad composite heat-treated at 175 °C strongly supports that the interface bonding can be enhanced during aging of Al-Mg-Si alloy layer in Cu/Al-Mg-Si/Cu clad composite. The increased ductility in the aged Cu/Al-Mg-Si/Cu clad composite can be attributed to the enhanced interface bonding and precipitation in Al-Mg-Si layers.

Key words
composites, clad, roll bonding, interface, strength, conductivity

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Full title of this journal is bilingual: Kovové materiály - Metallic Materials.
The official abbreviation in accordance with JCR ISI is Kovove Mater.

Article abstracts updated: 2018-02-20 07:23      
Articles in press revised: 2017-11-14 12:19     
Full text pdf uploaded: 2018-02-20 07:21    
Information updated: 2017-12-23 08:33   
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