[Kovove materialy - Metallic materials]
    Thu - March 28, 2024 - 22:17 No. of hits : 1736492 ISSN 1338-4252 (online) ISSN 0023-432X (printed)
© Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovak Republic

VOLUME 50 (2012), Issue 5

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
RUDAJEVOVA, A., DUŠEK, K.
vol. 50 (2012), no. 5, pp. 295 - 300

Abstract
Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature up to 400 °C. The transformation temperatures for melting as well as for solidification were influenced by the composition and thermal history of the alloys. The thermal history was altered by changing the maximum thermal cycle temperature and the heating/cooling rate. It is shown that the rate of solidification is far larger than that of the melting. The solidification rate is not influenced by neither the composition nor the thermal history of the material. Analysis of these results is presented.

Key words
Sn alloys, phase transformations, undercooling solidification, DSC

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Full title of this journal is bilingual: Kovové materiály - Metallic Materials.
The official abbreviation in accordance with JCR ISI is Kovove Mater.


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