[Kovove materialy - Metallic materials]
    Thu - March 28, 2024 - 09:35 No. of hits : 1736349 ISSN 1338-4252 (online) ISSN 0023-432X (printed)
© Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovak Republic

VOLUME 47 (2009), Issue 1

The effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate
HARCUBA, P., JANECEK, M., SLAMOVA, M.
vol. 47 (2009), no. 1, pp. 25 - 29

Abstract
The influence of Cu and Ni additions on the morphology of the intermetallic compounds (IMC) formed at the interface of the liquid Sn-Cu solder and the Cu substrate has been studied. At low Cu concentrations only a thin IMC layer is formed which remains almost unchanged in time and the substrate is dissolving quickly. Ni additions significantly accelerate the growth kinetics of the IMC layer, prevent the formation of a Cu3Sn layer and reduce the rate of substrate dissolution.

Key words
lead-free solders, intermetallic layer formation, Sn-Cu alloys, Cu substrate

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Full title of this journal is bilingual: Kovové materiály - Metallic Materials.
The official abbreviation in accordance with JCR ISI is Kovove Mater.


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