|Identification of phases in Sn-Ag-Cu-In solder on Cu substrate interface (Letter to the editor) |
SEBO, P., SVEC, P., JANICKOVIC, D., MOSER, Z.
vol. 46 (2008), no. 4, pp. 235 - 238
Determination of the phases arising at the interface between lead-free Sn3.5Ag0.4Cu29.5In solder and copper substrate after wetting of copper at 280 °C for 1800 s is presented. Compared are results obtained with methods of scanning electron microscopy (SEM) equipped with EDX analyser, X-ray diffraction and X-scan X-ray diffraction method. Standard X-ray diffraction profile shows the existence of four phases In0.2Sn0.8, Cu6Sn5, In3Sn and Ag3Sn. X-scan X-ray diffraction profile shows the presence of two phases at the interface In0.2Sn0.8 and Cu6Sn5 and adjacent phase to the copper substrate is In0.2Sn0.8 phase. Comparison of both methods is discussed.
X-scan, lead-free solder, copper, interface, phase analysis
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