[Kovove materialy - Metallic materials]
    Wed - April 24, 2024 - 11:03 No. of hits : 1743776 ISSN 1338-4252 (online) ISSN 0023-432X (printed)
© Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovak Republic

VOLUME 35 (1997), Issue 3

Processing, structure and properties of directionally solidified YBa2Cu3O7-x superconductor (in Slovak)
LAPIN, J.
vol. 35 (1997), no. 3, pp. 174 - 187

Abstract
Processing, structure and some physical properties of directionally solidified high temperature ceramic superconductor of YBa2Cu3O7-x + 20 wt.% Y2BaCuO5 type are reported. The structure of directionally solidified superconductors consisted of several grains with a - b planes oriented along the axis of the samples. The microstructure of the grains consisted of YBa2Cu3O7-x parallel plates and Y2BaCuO5 particles with a mean diameter of 2.1 × 10-6 m. After heat treatments in a dynamic oxygen atmosphere the critical temperature was measured to be Tc = 91 ± K. From magnetic measurements, critical current density Jc at 77 K in a direction parallel to a - b planes was determined to be 5 × 104 A cm-2 in zero magnetic field. In magnetic fields parallel to c axis (B || c), the Jc values significantly decreased to 11.9 x 103 and 1 × 103 A cm-2 at B = 0.15 and 4 T, respectively. In magnetic fields perpendicular to c axis (B || c), the Jc values of 3 × 103 and 1.3 × 103 A cm-2 were measured at 0.15 and 4 T, respectively.

Key words
processing, structure, physical properties, YBa2Cu3O7-x superconductor

Full text not available

[IMMS SAS]      UMMS SAV - Bratislava (SK) Personal data Protection   ver. 1.8.0      [go to HOME PAGE]
Full title of this journal is bilingual: Kovové materiály - Metallic Materials.
The official abbreviation in accordance with JCR ISI is Kovove Mater.


Article abstracts updated: 2023-10-26 07:45      
Articles in press revised: 2024-04-23 13:33     
Full text pdf uploaded: 2023-11-08 06:53    
Information updated: 2023-04-19 16:14   
Code last revised: 2024-03-06 11:13  

© OldSoft, 2004, …, 2024